Process vs. Density in DRAMs

by Geoff MacGillivray EE Times, 4 Jul 2005 The DRAM marketplace is one of the toughest markets in the semiconductor industry because margins are razor thin, even for the most cost-effective manufacturers. Therefore, DRAM makers must continually find ways to reduce cost while meeting market demands for larger memory densities and higher speeds. The most effective method available is to reduce die size through process shrinks and innovative design techniques such as 6F2 cell design. Read more