The Great Debate: SoC vs. SiP

by Ron Wilson EE Times, 21 MAr 2005 System-in-package or system-on-chip? Even in designs with severe space constraints, the right level of integration is never an easy decision. SiP technology is showing a new level of maturity, nothing like the bad old days of custom-built multichip modules on unobtainium substrates. And SoC technology is extending its reach, with a number of vendors doing small-signal RF circuitry in vanilla-CMOS processes. How does the design team decide whether to put the RF stages on separate, optimized dice or to integrate them onto the baseband die? Read the article