Intel To Unveil New Way To Connect Chips

by Michael Kanellos ZDNet News, 2 Mar 2005 Intel will unveil on Thursday a way for opening up the data paths between chips, CNET News.com has learned, one of the huge hurdles in increasing performance. Called through-silicon vias, or TSV, the technique involves stacking chips vertically in a package and then creating connections between the bottom of the top chip and the top of the bottom chip. These wires will greatly expand the means to exchange data between chips, sources said. Read the article